Embedded capacitor technology, where thin film
capacitors are integrated at on-chip and/or off-chip
levels, offers high packaging densities and improved
electrical performance at potentially reduced costs
of capacitor fabrication and integration. This
research explores and establishes the leverages of
using thin film embedded capacitors over currently
used surface mount discrete capacitors. In
particular, this work focuses on developing pulsed
dc reactively sputtered tantalum oxide (Ta2O5) thin
film capacitors for IC chips and packages. A design
space for breakdown voltage and capacitance density
of planar capacitors is established, with film
thickness and material dielectric constant as
parameters. The validity of the developed design
space is experimentally verified with Ta2O5 thin
films over a wide range of film thickness. An
experimentally verified analytical model for pulsed
dc reactive sputtering of Ta2O5 films is described
and evaluated. Various processing and integration
challenges in depositing thin films using reactive
sputtering and their effects on electrical
performance of thin-film capacitors are discussed.
Ik heb een vraag over het boek:
‘Tantalum Oxide Thin Films for Embedded Capacitors - Jain, Pushkar’.
Vul het onderstaande formulier in.
We zullen zo spoedig mogelijk antwoorden.
